Product Name

Mono-Si Texturing Cleaning Equipment

Model

KSTEX

Route Application

TOPCON, PERC, HIT, XBC, Stacked Batteries, etc.

Function

Utilizing the anisotropic reaction of silicon in alkali to prepare a uniform pyramid velvet structure on the surface of silicon wafers, enhancing the light trapping effect of silicon wafers.

Process Flow

Rough Polishing→ Pre-cleaning→Texturing→Post Cleaning (compatible with O3 cleaning)→Pickling→Pre-dehydration→Drying

Compatible Wafer

182x182mm, compatible with various sizes of 18X-230 silicon wafers

Cassette Number

4, 6 cassettes

Capacity

182: ≥16000 pcs/hour; 210: ≥12500 pcs/hour

Breakage Rate

Breakage Rate <0.01% (Silicon wafer thickness ≥130um)

Power Consumption/ Voltage

310KW/ 380V50Hz, 3-phase 5-wire

Features

The prepared pyramid structure is uniform, and the etching depth is adjustable; supports MES, RFID, and optional online weighing functions; one-key cleaning and slot replacement online for simple and quick solution exchange; the circulation volume of the process tank can be adjusted according to process requirements.